Datasheet J270 (InterFET) - 3
| Fabricante | InterFET |
| Descripción | P-Channel JFET |
| Páginas / Página | 4 / 3 — InterFET. J270-1. SOT23 (TO-236AB) Mechanical and Layout Data. Package … |
| Formato / tamaño de archivo | PDF / 348 Kb |
| Idioma del documento | Inglés |
InterFET. J270-1. SOT23 (TO-236AB) Mechanical and Layout Data. Package Outline Data. Suggested Pad Layout
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J270-1 SOT23 (TO-236AB) Mechanical and Layout Data Package Outline Data
1. All linear dimensions are in millimeters. 2. Package weight approximately 0.12 grams 3. Molded plastic case UL 94V-0 rated 4. For Tape and Reel specifications refer to InterFET CTC-021 Tape and Reel Specification, Document number: IF39002 5. Bulk product is shipped in standard ESD shipping material 6. Refer to JEDEC standards for additional information.
Suggested Pad Layout
1. All linear dimensions are in millimeters. 2. The suggested land pattern dimensions have been provided for reference only. A more robust pattern may be desired for wave soldering. J270-1 3 of 4 InterFET Corporation Document Number: IF35090.R00 www.InterFET.com June, 2019
Product Technical Ord Or er d Folder Support Now
J270-1 SOT23 (TO-236AB) Mechanical and Layout Data Package Outline Data
1. All linear dimensions are in millimeters. 2. Package weight approximately 0.12 grams 3. Molded plastic case UL 94V-0 rated 4. For Tape and Reel specifications refer to InterFET CTC-021 Tape and Reel Specification, Document number: IF39002 5. Bulk product is shipped in standard ESD shipping material 6. Refer to JEDEC standards for additional information.
Suggested Pad Layout
1. All linear dimensions are in millimeters. 2. The suggested land pattern dimensions have been provided for reference only. A more robust pattern may be desired for wave soldering. J270-1 3 of 4 InterFET Corporation Document Number: IF35090.R00 www.InterFET.com June, 2019