Datasheet SI7489DP (Vishay) - 9
| Fabricante | Vishay |
| Descripción | P-Channel 100-V (D-S) MOSFET |
| Páginas / Página | 13 / 9 — Application Note AN821. PowerPAK® SO-8 Mounting and Thermal … |
| Formato / tamaño de archivo | PDF / 309 Kb |
| Idioma del documento | Inglés |
Application Note AN821. PowerPAK® SO-8 Mounting and Thermal Considerations. PowerPAK SO-8 DUAL. REFLOW SOLDERING
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Application Note AN821
www.vishay.com Vishay Siliconix
PowerPAK® SO-8 Mounting and Thermal Considerations PowerPAK SO-8 DUAL
For the lead (Pb)-free solder profile, see The pin arrangement (drain, source, gate pins) and the pin www.vishay.com/doc?73257. dimensions of the PowerPAK SO-8 dual are the same as standard SO-8 dual devices. Therefore, the PowerPAK device connection pads match directly to those of the SO-8. As in the single-channel package, the only exception is the extended drain connection area. Manufacturers can likewise take immediate advantage of the PowerPAK SO-8 dual devices by mounting them to existing SO-8 dual land patterns. To take the advantage of the dual PowerPAK SO-8’s thermal performance, the minimum recommended land pattern can be found in Application Note 826, Recommended Minimum Pad Patterns With Outline Drawing Access for Vishay Siliconix MOSFETs. Click on the PowerPAK 1212-8 dual in the index of this document. The gap between the two drain pads is 24 mils. This matches the spacing of the two drain pads on the Fig. 3 Solder Reflow Temperature Profile PowerPAK SO-8 dual package.
REFLOW SOLDERING
Ramp-Up Rate + 3 °C /s max. Vishay Siliconix surface-mount packages meet solder reflow Temperature at 150 - 200 °C 120 s max. reliability requirements. Devices are subjected to solder Temperature Above 217 °C 60 - 150 s reflow as a test preconditioning and are then Maximum Temperature 255 + 5/- 0 °C reliability-tested using temperature cycle, bias humidity, Time at Maximum 30 s HAST, or pressure pot. The solder reflow temperature profile Temperature used, and the temperatures and time duration, are shown in Ramp-Down Rate + 6 °C/s max. figures 3 and 4. 30 s 260 °C 3 °C(max) 6 ° C/s (max.) 217 °C 150 - 200 °C 150 s (max.) 60 s (min.) Reflow Zone Pre-Heating Zone Maximum peak temperature at 240 °C is allowed. N NOTE O Fig. 4 Solder Reflow Temperatures and Time Durations Revision: 16-Mai-13
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Document Number: 71622 APPLICATI For technical questions, contact: powermosfettechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
www.vishay.com Vishay Siliconix
PowerPAK® SO-8 Mounting and Thermal Considerations PowerPAK SO-8 DUAL
For the lead (Pb)-free solder profile, see The pin arrangement (drain, source, gate pins) and the pin www.vishay.com/doc?73257. dimensions of the PowerPAK SO-8 dual are the same as standard SO-8 dual devices. Therefore, the PowerPAK device connection pads match directly to those of the SO-8. As in the single-channel package, the only exception is the extended drain connection area. Manufacturers can likewise take immediate advantage of the PowerPAK SO-8 dual devices by mounting them to existing SO-8 dual land patterns. To take the advantage of the dual PowerPAK SO-8’s thermal performance, the minimum recommended land pattern can be found in Application Note 826, Recommended Minimum Pad Patterns With Outline Drawing Access for Vishay Siliconix MOSFETs. Click on the PowerPAK 1212-8 dual in the index of this document. The gap between the two drain pads is 24 mils. This matches the spacing of the two drain pads on the Fig. 3 Solder Reflow Temperature Profile PowerPAK SO-8 dual package.
REFLOW SOLDERING
Ramp-Up Rate + 3 °C /s max. Vishay Siliconix surface-mount packages meet solder reflow Temperature at 150 - 200 °C 120 s max. reliability requirements. Devices are subjected to solder Temperature Above 217 °C 60 - 150 s reflow as a test preconditioning and are then Maximum Temperature 255 + 5/- 0 °C reliability-tested using temperature cycle, bias humidity, Time at Maximum 30 s HAST, or pressure pot. The solder reflow temperature profile Temperature used, and the temperatures and time duration, are shown in Ramp-Down Rate + 6 °C/s max. figures 3 and 4. 30 s 260 °C 3 °C(max) 6 ° C/s (max.) 217 °C 150 - 200 °C 150 s (max.) 60 s (min.) Reflow Zone Pre-Heating Zone Maximum peak temperature at 240 °C is allowed. N NOTE O Fig. 4 Solder Reflow Temperatures and Time Durations Revision: 16-Mai-13
2
Document Number: 71622 APPLICATI For technical questions, contact: powermosfettechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000