Datasheet MAX16126, MAX16127 (Analog Devices) - 2
| Fabricante | Analog Devices |
| Descripción | Load-Dump/Reverse-Voltage Protection Circuits |
| Páginas / Página | 19 / 2 — MAX16126/MAX16127. Absolute Maximum Ratings. Package Thermal … |
| Formato / tamaño de archivo | PDF / 1.2 Mb |
| Idioma del documento | Inglés |
MAX16126/MAX16127. Absolute Maximum Ratings. Package Thermal Characteristics (Note 1). Note 1:
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MAX16126/MAX16127
Load-Dump/Reverse-Voltage Protection Circuits
Absolute Maximum Ratings
(All pins referenced to GND.) Continuous Sink/Source (all pins) ..±100mA IN ..-36V to +90V Continuous Power Dissipation (TA = +70°C) (multilayer board) SHDN ...-0.3V to max (0V, VIN + 0.3V) TQFN (derate 14.7mW/°C above +70°C)...1176.5mW TERM ...-0.3V to max (0V, VIN + 0.3V) Operating Temperature Range ... -40°C to +125°C SRC, GATE ..-36V to +45V Junction Temperature ..+150°C SRC to GATE ...-36V to +36V Storage Temperature Range .. -60°C to +150°C OUT ...-0.3V to +45V Lead Temperature (soldering, 10s) ...+300°C FLAG ...-0.3V to +45V Soldering Temperature (reflow) ...+260°C OVSET, UVSET ...-0.3V to +6V Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Package Thermal Characteristics (Note 1)
TQFN Junction-to-Ambient Thermal Resistance (θJA) ...46.91°C/W Junction-to-Case Thermal Resistance (θJC) ..5.27°C/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial
.
Electrical Characteristics
(VIN = 12V, CGATE-SOURCE = 1nF, TA = -40°C to +125°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Operating range 3 30 Input Voltage Range VIN V Protection range -36 +90 VIN = VSRC = V SHDN = high OUT = 12V 224 360 VIN = VSRC = Input Supply Current IIN µA VOUT = 30V 260 400 VIN = 12V 34 60 SHDN = low VIN = 30V 64 100 V SRC Input Current I SRC = VIN = 12V, SHDN = high 136 200 SRC µA VSRC = VIN = 30V, SHDN = high 240 350 IN Undervoltage Lockout VUVLO VIN rising 2.92 V OVSET/UVSET Input Current IUVSET/OVSET 100 nA OVSET/UVSET Threshold (Rising) VTH VIN rising 1.2 1.225 1.25 V OVSET/UVSET Threshold Hysteresis V 0.05 x TH-HYS V V TH POK Threshold Rising V 0.9 x POK+ V V IN POK Threshold Falling V 0.87 x POK- V V IN TERM On-Resistance RTERM 0.7 1.2 kΩ www.analog.com Analog Devices │ 2
Load-Dump/Reverse-Voltage Protection Circuits
Absolute Maximum Ratings
(All pins referenced to GND.) Continuous Sink/Source (all pins) ..±100mA IN ..-36V to +90V Continuous Power Dissipation (TA = +70°C) (multilayer board) SHDN ...-0.3V to max (0V, VIN + 0.3V) TQFN (derate 14.7mW/°C above +70°C)...1176.5mW TERM ...-0.3V to max (0V, VIN + 0.3V) Operating Temperature Range ... -40°C to +125°C SRC, GATE ..-36V to +45V Junction Temperature ..+150°C SRC to GATE ...-36V to +36V Storage Temperature Range .. -60°C to +150°C OUT ...-0.3V to +45V Lead Temperature (soldering, 10s) ...+300°C FLAG ...-0.3V to +45V Soldering Temperature (reflow) ...+260°C OVSET, UVSET ...-0.3V to +6V Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Package Thermal Characteristics (Note 1)
TQFN Junction-to-Ambient Thermal Resistance (θJA) ...46.91°C/W Junction-to-Case Thermal Resistance (θJC) ..5.27°C/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial
.
Electrical Characteristics
(VIN = 12V, CGATE-SOURCE = 1nF, TA = -40°C to +125°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Operating range 3 30 Input Voltage Range VIN V Protection range -36 +90 VIN = VSRC = V SHDN = high OUT = 12V 224 360 VIN = VSRC = Input Supply Current IIN µA VOUT = 30V 260 400 VIN = 12V 34 60 SHDN = low VIN = 30V 64 100 V SRC Input Current I SRC = VIN = 12V, SHDN = high 136 200 SRC µA VSRC = VIN = 30V, SHDN = high 240 350 IN Undervoltage Lockout VUVLO VIN rising 2.92 V OVSET/UVSET Input Current IUVSET/OVSET 100 nA OVSET/UVSET Threshold (Rising) VTH VIN rising 1.2 1.225 1.25 V OVSET/UVSET Threshold Hysteresis V 0.05 x TH-HYS V V TH POK Threshold Rising V 0.9 x POK+ V V IN POK Threshold Falling V 0.87 x POK- V V IN TERM On-Resistance RTERM 0.7 1.2 kΩ www.analog.com Analog Devices │ 2