Datasheet THAT 300 (THAT Corporation) - 4

Document 600041 Rev 04 Page 4 of 8 THAT 300 Series Transistor Array ICs
Packaging and Soldering Information
The THAT 300, 320 and 340 are available in 14-pin Neither the lead-frames nor the plastic mold PDIP and 14-pin surface mount (SOIC) packages. compounds used in the 300-series contains any hazard- Package dimensions are shown below. ous substances as specified in the European Union's Directive on the Restriction of the Use of Certain Hazard- The 300-series packages are entirely lead-free. The lead-frames are copper, plated with successive layers of ous Substances in Electrical and Electronic Equipment nickel, palladium, and gold. This approach makes it 2002/95/EG of January 27, 2003. The surface-mount possible to solder these devices using lead-free and lead- package is suitable for use in a 100% tin solder process. bearing solders.
Package Characteristics
Parameter Symbol Conditions Typ Units
Through-hole package
See Fig. 4 for dimensions 14 Pin PDIP Thermal Resistance θJA DIP package soldered to board 100 ºC/W Environmental Regulation Compliance Complies with January 27, 2003 RoHS requirements
Surface mount package
See Fig. 5 for dimensions 14 Pin SOP Thermal Resistance θJA SO package soldered to board 100 ºC/W Soldering Reflow Profile JEDEC JESD22-A113-D (250 ºC) Moisture Sensitivity Level MSL Above-referenced JEDEC soldering profile 1 Environmental Regulation Compliance Complies with RoHS requirements a° e e E H J E H L 1 C D B C S F D F SEATING A1 A PLANE L B A1 A SYM MM Inches MM Inches Min Max Min Max SYM Min Max Min Max A 3.30 4.32 0.130 0.170 A1 0.38 1.02 0.015 0.040 A 1.35 1.75 0.053 0.069 B 0.41 0.51 0.016 0.020 A1 0.10 0.25 0.004 0.010 C 0.23 0.30 0.009 0.012 B 0.36 0.48 0.014 0.019 D 18.92 19.43 0.745 0.765 C 0.18 0.25 0.007 0.010 E 6.10 6.86 0.240 0.270 D 8.53 8.79 0.336 0.346 e 2.54 BSC 0.100 BSC E 3.81 4.01 0.150 0.158 F 2.29 3.94 0.090 0.155 e 1.27 BSC 0.050 BSC H 7.62 8.26 0.300 0.325 F 1.09 1.65 0.043 0.065 J 7.87 9.65 0.310 0.380 H 5.84 6.20 0.230 0.244 L 3.05 3.56 0.120 0.140 L 0.41 0.89 0.016 0.035 S 1.78 2.03 0.070 0.080 a° 0° 8° 0° 8° Figure 4. Dual-In-Line Package Outline Figure 5. Surface-Mount Package Outline THAT Corporation; 45 Sumner Street; Milford, Massachusetts 01757-1656; USA Tel: +1 508 478 9200; Fax: +1 508 478 0990; Web: www.thatcorp.com Copyright © 2013, THAT Corporation. All rights reserved. Document Outline Home Features & Applications Description Ordering Information Pin Assignments Specifications Absolute Maximum Ratings NPN Electrical Characteristics PNP Electrical Characteristics Packaging and Soldering Information Package Characteristics Revision History