Datasheet NC7SZ14 (ON Semiconductor) - 2
| Fabricante | ON Semiconductor |
| Descripción | TinyLogic UHS Inverter with Schmitt Trigger Input |
| Páginas / Página | 11 / 2 — NC7SZ14. Pin Configurations. Figure 2. SOT23−5, SC−88A and SC−74A. Figure … |
| Formato / tamaño de archivo | PDF / 552 Kb |
| Idioma del documento | Inglés |
NC7SZ14. Pin Configurations. Figure 2. SOT23−5, SC−88A and SC−74A. Figure 3. MicroPak (Top Through View). (Top View)
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NC7SZ14 Pin Configurations
NC 1 6 V NC 1 5 CC VCC A 2 A 2 5 NC GND 3 4 Y GND 3 4 Y
Figure 2. SOT23−5, SC−88A and SC−74A Figure 3. MicroPak (Top Through View) (Top View) PIN DEFINITIONS FUNCTION TABLE Pin # SC−88A / Inputs Output SC74A/ SOT23−5 Pin # MicroPak Name Description A Y
1 1, 5 NC No Connect L H 2 2 A Input H L 3 3 GND Ground H = HIGH Logic Level L = LOW Logic Level 4 4 Y Output 5 6 VCC Supply Voltage
ABSOLUTE MAXIMUM RATINGS Symbol Parameter Min Max Unit
VCC Supply Voltage −0.5 6.5 V VIN DC Input Voltage −0.5 6.5 V VOUT DC Output Voltage −0.5 6.5 V IIK DC Input Diode Current VIN < 0 V − −50 mA IOK DC Output Diode Current VOUT < 0 V − −50 mA IOUT DC Output Current − ±50 mA ICC or IGND DC VCC or Ground Current − ±50 mA TSTG Storage Temperature Range −65 +150 °C TJ Junction Temperature Under Bias − +150 °C TL Junction Lead Temperature (Soldering, 10 Seconds) − +260 °C PD Power Dissipation in Still Air SC−74A / SOT23−5 − 390 mW SC−88A − 332 MicroPak−6 − 812 MicroPak2™−6 − 812 ESD Human Body Model, JEDEC: JESD22−A114 − 2000 V Charge Device Model, JEDEC: JESD22−C101 − 1000 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.
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NC 1 6 V NC 1 5 CC VCC A 2 A 2 5 NC GND 3 4 Y GND 3 4 Y
Figure 2. SOT23−5, SC−88A and SC−74A Figure 3. MicroPak (Top Through View) (Top View) PIN DEFINITIONS FUNCTION TABLE Pin # SC−88A / Inputs Output SC74A/ SOT23−5 Pin # MicroPak Name Description A Y
1 1, 5 NC No Connect L H 2 2 A Input H L 3 3 GND Ground H = HIGH Logic Level L = LOW Logic Level 4 4 Y Output 5 6 VCC Supply Voltage
ABSOLUTE MAXIMUM RATINGS Symbol Parameter Min Max Unit
VCC Supply Voltage −0.5 6.5 V VIN DC Input Voltage −0.5 6.5 V VOUT DC Output Voltage −0.5 6.5 V IIK DC Input Diode Current VIN < 0 V − −50 mA IOK DC Output Diode Current VOUT < 0 V − −50 mA IOUT DC Output Current − ±50 mA ICC or IGND DC VCC or Ground Current − ±50 mA TSTG Storage Temperature Range −65 +150 °C TJ Junction Temperature Under Bias − +150 °C TL Junction Lead Temperature (Soldering, 10 Seconds) − +260 °C PD Power Dissipation in Still Air SC−74A / SOT23−5 − 390 mW SC−88A − 332 MicroPak−6 − 812 MicroPak2™−6 − 812 ESD Human Body Model, JEDEC: JESD22−A114 − 2000 V Charge Device Model, JEDEC: JESD22−C101 − 1000 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.
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