Datasheet S6846 (Hamamatsu) - 9

Light modulation photo IC S4282-51, S6809, S6846, S6986, S7136/-10, S10053/-01DT Recommended soldering conditions
S4282-51, S6809, S6846, S6986, S7136/-10
Type No.
Solder temperature
Remarks
S4282-51
at least 1 mm away from lead roots*6
230
°C (less
than
s) max.
S6809,example
S6846, of
S6986
at least 1.8 mm away from lead roots*6
Measured
temperature profile with our
hot-air
reflow
oven5 for
product testing
S7136
at least 1 mm away from lead roots*6
*7
S7136-10
*6: Lead length: in case of 2 mm or more
*7: Contact us for detailed information.
Note: When setting the soldering conditions, check for any problems by testing out the soldering methods in advance. S10053/-01DT
The S10053/-01DT supports lead-free soldering. After unpacking, store it in an environment at a temperature of 30 °C or less and a
humidity of 60% or less, and perform soldering within 24 hours.
300 °C
240 °C max. Temperature 220 °C
190 °C
170 °C Preheat
70 to 90 s Soldering
40 s max. Time
KPICB0171EA Note: T he effect that the product receives during reflow soldering varies depending on the circuit board and reflow oven that are
used. When setting the reflow soldering conditions, check for any problems by testing out the reflow soldering methods in
advance. KPICB0171EA 9