Datasheet BD6xxx (STMicroelectronics) - 9

BD6xxx Package mechanical data 3 Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 9/12 Document Outline Figure 1. Internal schematic diagram Table 1. Device summary 1 Absolute maximum ratings Table 2. Absolute maximum ratings 2 Electrical characteristics Table 3. Electrical characteristics 2.1 Typical characteristic (curves) Figure 2. DC current gain (NPN) Figure 3. DC current gain (PNP) Figure 4. DC current gain (NPN) Figure 5. DC current gain (PNP) Figure 6. Collector-emitter saturation voltage (NPN) Figure 7. Collector-emitter saturation voltage (PNP) Figure 8. Base-emitter saturation voltage (NPN) Figure 9. Base-emitter saturation voltage (PNP) Figure 10. Base-emitter voltage (NPN) Figure 11. Base-emitter voltage (PNP) Figure 12. Resistive load switching time (NPN, on) Figure 13. Resistive load switching time (PNP, on) Figure 14. Resistive load switching time (NPN, off) Figure 15. Resistive load switching time (PNP, off) 2.2 Test circuit Figure 16. Resistive load switching test circuit 3 Package mechanical data 4 Revision history Table 4. Document revision history