Datasheet B57891S (TDK) - 8

FabricanteTDK
DescripciónNTC thermistors for temperature measurement in Disc, 4.5mm Dia x 4.5mm W package
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Temperature measurement and compensation. B57891S. Leaded NTC thermistors, lead spacing 2.5 mm. S891

Temperature measurement and compensation B57891S Leaded NTC thermistors, lead spacing 2.5 mm S891

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Temperature measurement and compensation B57891S Leaded NTC thermistors, lead spacing 2.5 mm S891 Packing units for discrete chip
Case size Chip thickness Cardboard tape Blister tape ∅ 180-mm reel ∅ 330-mm reel inch/mm th W W pcs. pcs. 0402/1005 0.5 mm 8 mm 10000 50000 0603/1608 0.8 mm 8 mm 8 mm 4000 16000 0805/2012 0.8 mm 8 mm 2000/ 4000 16000 1.2 mm 8 mm 3000 12000 1206/3216 0.8 mm 8 mm 2000 12000 1.2 mm 8 mm 4000 12000
3 Packing codes
The last two digits of the complete ordering code state the packing mode: Last two digits 60 SMD Cardboard tape 180-mm reel packing 62 SMD Blister tape 180-mm reel packing 70 SMD Cardboard tape 330-mm reel packing 72 SMD Blister tape 330-mm reel packing Please read Cautions and warnings and Page 8 of 27 Important notes at the end of this document. Document Outline Cover