Datasheet LTC7892 (Analog Devices) - 9

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Data Sheet LTC7892 ABSOLUTE MAXIMUM RATINGS
TA = 25°C unless otherwise specified.
Table 2. Absolute Maximum Ratings PARAMETER RATING
Bias Input Supply (VBIAS) –0.3V to 100V RUN1 and RUN2 –0.3V to 100V BOOST1 and BOOST2 –0.3V to 106V SW1 and SW2 –5V to 100V BOOST1 to SW1 and BOOST2 to SW2 –0.3V to 6V TGUP1, TGUP2, TGDN1, TGDN2
1
Not applicable BGUP1, BGUP2, BGDN1, BGDN2
1
Not applicable EXTVCC –0.3V to 30V DRVCC and INTVCC –0.3V to 6V VFB1 –0.3V to 65V PLLIN/SPREAD FREQ and VFB2 –0.3V to 6V SS1, SS2, ITH1, and ITH2 –0.3V to 6V DRVSET and DRVUV –0.3V to 6V MODE, ILIM, and VPRG1 –0.3V to 6V PGOOD1 and PGOOD2 –0.3V to 6V DTCA and DTCB -0.3V to 6V SENSE1+, SENSE2+, SENSE1–, and SENSE2– –0.3V to 65V SENSE1+ to SENSE1– and SENSE2+ to SENSE2– Continuous –0.3V to +0.3V SENSE1+ to SENSE1– and SENSE2+ to SENSE2– < 1ms -100mA to +100mA Operating Junction Temperature Range
2
–40°C to 125°C Storage Temperature Range –65°C to 150°C .1 Do not apply a voltage or current source to these pins. They must be connected to capacitive loads only. Otherwise, permanent damage can occur. 2 The LTC7892 is specified over the –40°C to 125°C operating junction temperature range. High junction temperatures degrade operating lifetimes. Note that the maximum ambient temperature consistent with these specifications is determined by specific operating conditions in conjunction with the board layout, rated package thermal impedance, and other environmental factors. The junction temperature (TJ, in °C) is calculated from the ambient temperature (TA, in °C) and power dissipation (PD, in Watts) according to the following formula: TJ = TA + (PD × θJA), where θJA is the package thermal impedance and equals 33°C/W for the 40-lead (6 mm × 6 mm), side wettable, quad flat no-lead (QFN) package.
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Rev. 0 9 of 50 Document Outline Features Applications General Description Typical Application Revision History Specifications Absolute Maximum Ratings Pin Configurations and Function Descriptions Typical Performance Characteristics Functional Diagram Theory of Operation Main Control Loop Power and Bias Supplies (VBIAS, EXTVCC, DRVCC, INTVCC) High Side Bootstrap Capacitor Dead Time Control (DTCA and DTCB Pins) Start-Up and Shutdown (RUN and SS Pins) Light Load Operation: Burst Mode Operation, Pulse-Skipping Mode, or Forced Continuous Mode (MODE Pin) Frequency Selection, Spread Spectrum, and Phase-Locked Loop (FREQ and PLLIN/SPREAD Pins) Output Overvoltage Protection Power Good Applications Information Inductor Value Calculation Inductor Core Selection Current Sense Selection Low Value Resistor Current Sensing Inductor DCR Current Sensing Setting the Operating Frequency Selecting the Light-Load Operating Mode Dead Time Control (DTCA and DTCB Pins) DTCx Pin Tied to Ground (Adaptive Dead Time Control) DTCx Pin connected with a resistor to GND Power FET Selection CIN and COUT Selection Single Output 2-Phase Operation Setting the Output Voltage RUNx Pins and Undervoltage Lockout Soft Start (SSx Pins) INTVCC Regulators (OPTI-DRIVE) Topside FET Driver Supply (CB) Minimum On-Time Considerations Fault Conditions: Overtemperature Protection Phase-Locked Loop and Frequency Synchronization Efficiency Considerations Checking Transient Response Design Example PCB Board Layout Checklist PCB Layout Debugging Typical Applications Related Parts Outline Dimensions Ordering Guide