Datasheet NT9003 (Nisshinbo) - 4

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Datasheet NT9003HDAE4S ■ ABSOLUTE MAXIMUM RATINGS
Symbol Ratings Unit Reverse voltage VR 20 V Forward current IF 20 mA Power dissipation PD *1 920 mW Junction temperature Tj +150 °C Storage temperature Tstg −55 ~ +150 °C *1 4-layer FR4 PCB with through-hole (101.5 x 114.5 mm), Tj = 150 °C ABSOLUTE MAXIMUM RATINGS Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause permanent damage and may degrade the lifetime and safety for both device and system using the device in the field. The functional operation at or over these absolute maximum ratings is not assured. Calculate the power consumption of the IC from the operating conditions and calculate the junction temperature with the thermal resistance. Please refer to "THERMAL CHARACTERISTICS" for the thermal resistance under our measurement board conditions.
■ THERMAL CHARACTERISTICS
Parameter Measurement Result Thermal Resistance (ja) ja =135.3 °C/W ja: Junction-to-Ambient Thermal Resistance Ver.1.1 - 4 - Document Outline FEATURES GENERAL DESCRIPTION APPLICATIONS BLOCK DIAGRAM ■ PRODUCT NAME INFORMATION ■ ORDER INFORMATION ■ PIN DESCRIPTIONS ■ ABSOLUTE MAXIMUM RATINGS ■ THERMAL CHARACTERISTICS ■ ELECTROSTATIC DISCHARGE RATINGS ■ RECOMMENDED OPERATING CONDITIONS ■ ELECTRICAL CHARACTERISTICS (DC) ■ TYPICAL CHARACTERISTICS ■ SPICE MODEL ● Notes on Using the SPICE Model ■ MARKING SPECIFICATION ■ REVISION HISTORY PACKAGE INFORMATION CAUTION