Datasheet EPC2218 (Efficient Power Conversion) - 5
| Fabricante | Efficient Power Conversion |
| Descripción | 100 V, 231 A Enhancement-Mode GaN Power Transistor |
| Páginas / Página | 7 / 5 — eGaN® FET DATASHEET. TAPE AND REEL CONFIGURATION. Z Z. a b c. YYY. 2218. … |
| Formato / tamaño de archivo | PDF / 1.3 Mb |
| Idioma del documento | Inglés |
eGaN® FET DATASHEET. TAPE AND REEL CONFIGURATION. Z Z. a b c. YYY. 2218. DIM. Dimension (mm). EPC2218 (Note 1) Target MIN. MAX

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eGaN® FET DATASHEET
EPC2218
TAPE AND REEL CONFIGURATION
8 mm pitch, 12 mm wide tape on 7” reel
e
Loaded Tape Feed Direction
d f g
7” inch reel Die orientation
Z Z ZZ
dot
a b c Y YYY
Gate solder bar is
2218
under this corner Die is placed into pocket solder bar side down (face side down)
DIM Dimension (mm) EPC2218 (Note 1) Target MIN MAX a
12.00 11.90 12.30
b
1.75 1.65 1.85
c
(Note 2) 5.50 5.45 5.55
d
4.00 3.90 4.10 Note 1: MSL 1 (moisture sensitivity level 1) classified according to IPC/
e
8.00 7.90 8.10 JEDEC industry standard.
f
(Note 2) 2.00 1.95 2.05 Note 2: Pocket position is relative to the sprocket hole measured as
g
1.50 1.50 1.60 true position of the pocket, not the pocket hole.
DIE MARKINGS 2218 YYYY Laser Markings
Die orientation dot
Part ZZZZ Number Part # Lot_Date Code Lot_Date Code Marking Line 1 Marking Line 2 Marking Line 3
Gate Pad bar is EPC2218 2218 YYYY ZZZZ under this corner
DIE OUTLINE
Solder Bump View A m
Micrometers DIM MIN Nominal MAX
e
A
3470 3500 3530
2 B
1920 1950 1980
c
1605 1625 1645
d
1780 1800 1820 h
3 4
d
5 6 7
c
8
B
e
755 775 795
f
230 250 270
g
500
1
e
h
1025 k
k
447 462.5
m
234 250 f g (x6) ± 25
Pad 1 is Gate;
Side View 518 638
Pads 2 ,4, 6, 8 are Source; Pads 3, 5, 7 are Drain
Seating plane Note: Dimensions
d
and
c
are centered 120 ± 12 EPC – POWER CONVERSION TECHNOLOGY LEADER | EPC-CO.COM | ©2026 | For more information:
info@epc-co.com
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