Datasheet 0ZCF (Bel) - 4
| Fabricante | Bel |
| Descripción | AEC-Q Compliant, surface mount PTC resettable fuse with fast trip time and high hold currents in 2920 chip size package |
| Páginas / Página | 4 / 4 — Environmental Specifications. Solder Reflow and Rework Recommendations |
| Formato / tamaño de archivo | PDF / 813 Kb |
| Idioma del documento | Inglés |
Environmental Specifications. Solder Reflow and Rework Recommendations
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Type 0ZCF Series
4
/
4 Environmental Specifications
Temperature cycling JESD22 Method JA-104 Biased humidity MIL-STD-202 Method 103 Operational life MIL-STD-202 Method 108 Resistance to solvents MIL-STD-202 Method 215 Mechanical shock MIL-STD-202 Method 213 Vibration MIL-STD-202 Method 204 Resistance to soldering heat MIL-STD-202 Method 210 Thermal shock MIL-STD-202 Method 107 Solderability ANSI/J-STD-002 Board flex(SMD) AEC-Q200-005 Terminal strength AEC-Q200-006
Solder Reflow and Rework Recommendations
Profile Feature Pb-Free Assembly Average Ramp-Up Rate (Tsmax to Tp) 3°C/second max Preheat : Temperature Min (Tsmin) 150°C Temperature Max (Tsmax) 200°C Time (tsmin to tsmax) 60-180 seconds Time maintained above: Temperature(TL) 217°C Time (tL) 60-150 seconds Peak/Classification Temperature(Tp) : 260°C Time within 5°C of actual Peak : Temperature (tp) 20-40 seconds Ramp-Down Rate : 6°C/second max. Time 25°C to Peak Temperature : 8 minutes max Solder Reflow Due to “lead free / RoHS Compliant ” construction of these PTC devices , the required Temperature and Dwell Time in the “ Soldering ” zone of the reflow profile are greater than those used for non-RoHS devices. 1. Recommended reflow methods; IR, vapor phase oven, hot air oven. 2. Not Recommended For Wave Solder / Direct Immersion. 3. Recommended paste thickness range – 0.20 – 0.25mm. 4. Devices are compatible with standard industry cleaning solvents and methods. 5. MSL: 2a (According to IPC J-Std-020). Caution If reflow temperature / dwell times exceed the recommended profile, the electrical performance of the PTC may be affected. Rework: MIL-STD-202G Method 210F, Test Condition A.
Standard Packaging P/N Explanation and Ordering Information
Part Number Tape/Reel Qty 0ZCF0030FF2C Thru 2,000 0ZCF0075AF2C 0ZCF0100AF2A 1,000 0ZCF0110AF2A 1,000 0ZCF0110FF2C Thru 2,000 0ZCF0330FF2C 0ZCF0400FF2A 1,000 0ZCF0500FF2A 2000 or 1000 fuses in 7 inches dia. Reel, 16mm wide tape, P1=8mm pitch, per EIA-481(equivalent IEC-286 part 3). Specifications subject to change without notice
Bel Fuse Inc.
+1 201.432.0463 300 Executive Drive, Suite 300, Bel.US.CS@belf.com West Orange, NJ 07052 USA
belfuse.com/circuit-protection
© 2026 Bel Fuse, Inc. Rev. 0ZCF Apr2026
4
/
4 Environmental Specifications
Temperature cycling JESD22 Method JA-104 Biased humidity MIL-STD-202 Method 103 Operational life MIL-STD-202 Method 108 Resistance to solvents MIL-STD-202 Method 215 Mechanical shock MIL-STD-202 Method 213 Vibration MIL-STD-202 Method 204 Resistance to soldering heat MIL-STD-202 Method 210 Thermal shock MIL-STD-202 Method 107 Solderability ANSI/J-STD-002 Board flex(SMD) AEC-Q200-005 Terminal strength AEC-Q200-006
Solder Reflow and Rework Recommendations
Profile Feature Pb-Free Assembly Average Ramp-Up Rate (Tsmax to Tp) 3°C/second max Preheat : Temperature Min (Tsmin) 150°C Temperature Max (Tsmax) 200°C Time (tsmin to tsmax) 60-180 seconds Time maintained above: Temperature(TL) 217°C Time (tL) 60-150 seconds Peak/Classification Temperature(Tp) : 260°C Time within 5°C of actual Peak : Temperature (tp) 20-40 seconds Ramp-Down Rate : 6°C/second max. Time 25°C to Peak Temperature : 8 minutes max Solder Reflow Due to “lead free / RoHS Compliant ” construction of these PTC devices , the required Temperature and Dwell Time in the “ Soldering ” zone of the reflow profile are greater than those used for non-RoHS devices. 1. Recommended reflow methods; IR, vapor phase oven, hot air oven. 2. Not Recommended For Wave Solder / Direct Immersion. 3. Recommended paste thickness range – 0.20 – 0.25mm. 4. Devices are compatible with standard industry cleaning solvents and methods. 5. MSL: 2a (According to IPC J-Std-020). Caution If reflow temperature / dwell times exceed the recommended profile, the electrical performance of the PTC may be affected. Rework: MIL-STD-202G Method 210F, Test Condition A.
Standard Packaging P/N Explanation and Ordering Information
Part Number Tape/Reel Qty 0ZCF0030FF2C Thru 2,000 0ZCF0075AF2C 0ZCF0100AF2A 1,000 0ZCF0110AF2A 1,000 0ZCF0110FF2C Thru 2,000 0ZCF0330FF2C 0ZCF0400FF2A 1,000 0ZCF0500FF2A 2000 or 1000 fuses in 7 inches dia. Reel, 16mm wide tape, P1=8mm pitch, per EIA-481(equivalent IEC-286 part 3). Specifications subject to change without notice
Bel Fuse Inc.
+1 201.432.0463 300 Executive Drive, Suite 300, Bel.US.CS@belf.com West Orange, NJ 07052 USA
belfuse.com/circuit-protection
© 2026 Bel Fuse, Inc. Rev. 0ZCF Apr2026