Datasheet AP7583Q, AP7583AQ (Diodes) - 4
| Fabricante | Diodes |
| Descripción | Wide Input Voltage Range, 300mA ULDO Regulator with PG |
| Páginas / Página | 21 / 4 — AP7583Q/AQ. Absolute Maximum Ratings. Symbol. Parameter. Rating. Unit. … |
| Formato / tamaño de archivo | PDF / 1.7 Mb |
| Idioma del documento | Inglés |
AP7583Q/AQ. Absolute Maximum Ratings. Symbol. Parameter. Rating. Unit. Recommended Operating Conditions. Min. Max. www.diodes.com
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AP7583Q/AQ Absolute Maximum Ratings
(Note 4) (@TA = +25°C, unless otherwise specified.)
Symbol Parameter Rating Unit
VIN Supply Input Voltage -0.3 to 45 V VOUT Regulated Output Voltage -0.3 to 7 V IOUT Output Current 300 mA TLEAD Lead Temperature (Soldering, 10sec) +260 ºC TJ Operating Junction Temperature +150 ºC MSOP-8EP 36.1 Thermal Resistance θJA W-DFN2020-6 (SWP) (Type A1) 80.4 °C/W (Junction to Ambient) TO252-4 (Type C) 27.2 MSOP-8EP 6.532 Thermal Resistance θJC W-DFN2020-6 (SWP) (Type A1) 26.4 °C/W (Junction to Case) TO252-4 (Type C) 7.5 TSTG Storage Temperature Range -40 to +150 °C CDM ESD (Charged Device Model) ±1500 V HBM ESD (Human Body Model) ±2000 V Notes: 4. a). Stresses beyond those listed under Absolute Maximum Ratings can cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to absolute-maximum-rated conditions for extended period can affect device reliability. b). Ratings apply to ambient temperature at +25°C. The JEDEC STD.51 High-K board design used to derive this data was a 3inch × 3inch multilayer board with 1oz. internal power and ground planes and 2oz. copper traces on the top and bottom of the board.
Recommended Operating Conditions Symbol Parameter Min Max Unit
VIN Supply Input Voltage 3.0 42 V VOUT Supply Output Voltage 1.2 5 V TJ Operating Junction Temperature -40 +125 °C Caution: VIN ramp-up slew rate needs to be slower than 200µs/V for proper operations under EN stays HIGH all the time. AP7583Q/AQ 4 of 21 April 2025 Document number: DS43764 Rev. 3 - 2
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© 2025 Copyright Diodes Incorporated. All Rights Reserved.
(Note 4) (@TA = +25°C, unless otherwise specified.)
Symbol Parameter Rating Unit
VIN Supply Input Voltage -0.3 to 45 V VOUT Regulated Output Voltage -0.3 to 7 V IOUT Output Current 300 mA TLEAD Lead Temperature (Soldering, 10sec) +260 ºC TJ Operating Junction Temperature +150 ºC MSOP-8EP 36.1 Thermal Resistance θJA W-DFN2020-6 (SWP) (Type A1) 80.4 °C/W (Junction to Ambient) TO252-4 (Type C) 27.2 MSOP-8EP 6.532 Thermal Resistance θJC W-DFN2020-6 (SWP) (Type A1) 26.4 °C/W (Junction to Case) TO252-4 (Type C) 7.5 TSTG Storage Temperature Range -40 to +150 °C CDM ESD (Charged Device Model) ±1500 V HBM ESD (Human Body Model) ±2000 V Notes: 4. a). Stresses beyond those listed under Absolute Maximum Ratings can cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to absolute-maximum-rated conditions for extended period can affect device reliability. b). Ratings apply to ambient temperature at +25°C. The JEDEC STD.51 High-K board design used to derive this data was a 3inch × 3inch multilayer board with 1oz. internal power and ground planes and 2oz. copper traces on the top and bottom of the board.
Recommended Operating Conditions Symbol Parameter Min Max Unit
VIN Supply Input Voltage 3.0 42 V VOUT Supply Output Voltage 1.2 5 V TJ Operating Junction Temperature -40 +125 °C Caution: VIN ramp-up slew rate needs to be slower than 200µs/V for proper operations under EN stays HIGH all the time. AP7583Q/AQ 4 of 21 April 2025 Document number: DS43764 Rev. 3 - 2
www.diodes.com
© 2025 Copyright Diodes Incorporated. All Rights Reserved.