Datasheet TB67S531FTG (Toshiba) - 6

TB67S531FTG
5.2. Input and Output Equivalent Circuit Table 5.2 Input and Output Equivalent Circuit Pin name Input-Output equivalent circuit
1 kΩ Logic Input pin PHASE_A, IN_A1, IN_A2 Ω PHASE_B, IN_B1, IN_B2 k TRQ, SLEEP_X 100 DECAY1, DECAY2 GND Logic Output pin LO1 GND VCC Logic LO2 Output pin GND GND VCC Regulator VREFA VREFB VREFA VREFB GND VCC Regulator OSCM OSCM GND VM VM OUTA1 OUTA2 OUTB1 OUTA1 OUTA2 OUTB2 RSGND_A RSGND_B RSGND_A/B Note: Same as OUTB1 and OUTB2 Note: The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. ©2026 6 2026-04-07 Toshiba Electronic Devices & Storage Corporation Rev. 1.0.A Document Outline 1. Description 2. Features 3. Block Diagram 4. Pin Assignments 5. Pin Description 5.1. Pin Function Description TB67S531FTG 5.2. Input and Output Equivalent Circuit 6. Functional Description: TB67S531FTG 6.1. SLEEP_X function 6.2. Phase input control mode 6.2.1. Functions of IN_A1, IN_A2, IN_B1, IN_B2, PHASE_A, PHASE_B 6.2.2. Sequence by each drive mode in phase input control mode 6.2.2.1. Full-step resolution 6.2.2.2. Half-step resolution 6.2.2.3. Quarter-step resolution 6.3. Torque function 6.4. Selectable Mixed Decay Function 6.4.1. Mixed Decay Waveform (Current Waveform) 6.4.2. Each Time of Constant Current PWM Operation 6.4.3. Mixed Decay Current Waveform 6.4.3.1. When the set current value is increased 6.4.3.2. When the Charge period is more than 1 fCHOP cycle 6.4.3.3. When the set current value is decreased 6.5. ADMD (Advanced Dynamic Mixed Decay) Constant Current Control 6.6. ADMD Current Waveform 6.6.1. When the next current value is increased 6.6.2. When Charge period ≥ 1 fCHOP cycle 6.6.3. When the next current value is decreased 6.6.4. Fast period > 1 fCHOP cycle (The motor current does not reach the ADMD threshold during 1 fCHOP cycle.) 6.7. LO (Error detection flag output) function 6.8. Output Transistor Function mode (Advanced Dynamic Mixed Decay) 6.9. Set current value (IOUT) 6.10. Chopping frequency (fCHOP) 6.11. Power consumption of the IC 6.11.1. Power consumption of the power transistor 6.11.2. Power consumption of logic and IM systems 6.11.3. Power consumption 6.12. Detection Function 6.12.1. Thermal shutdown detection (This function is a latch type that maintains the operation at the time of detection.) 6.12.1.1. When over temperature is detected: 6.12.2. Over-current detection (This function is a latch type that maintains the operation at the time of detection.) 6.12.2.1. When over-current is detected in the lower DMOS of H-bridge by the short-circuiting to the power supply 6.12.2.2. When over-current is detected in the upper DMOS of H-bridge by the short-circuiting to the ground: 7. Absolute Maximum Ratings (Ta = 25 C) 8. Operating Ranges (Ta = -40 to 85 C) 9. Electrical Characteristics 9.1. Electrical Characteristics 1 (Ta = 25 C, VM = 24 V, unless otherwise specified) 9.2. Electrical Characteristics 2 (Ta = 25 C, VM = 24 V, unless otherwise specified) 9.3. AC Electrical Characteristics (Ta = 25 C, VM = 24 V) 9.3.1. AC Electrical Characteristics Timing Chart 10. Application Circuit Example 11. Package Information 11.1. Package Dimensions 12. IC Usage Considerations 12.1. Notes on Handling of ICs 12.2. Points to Remember on Handling of Ics RESTRICTIONS ON PRODUCT USE