Datasheet LTC1440, LTC1441, LTC1442 (Analog Devices) - 15
| Fabricante | Analog Devices |
| Descripción | Ultralow Power Single/Dual Comparator with Reference |
| Páginas / Página | 16 / 15 — PACKAGE DESCRIPTION. N8 Package. 8-Lead PDIP (Narrow 0.300). S8 Package. … |
| Formato / tamaño de archivo | PDF / 259 Kb |
| Idioma del documento | Inglés |
PACKAGE DESCRIPTION. N8 Package. 8-Lead PDIP (Narrow 0.300). S8 Package. 8-Lead Plastic Small Outline (Narrow 0.150)
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Versión de texto del documento
LTC1440/LTC1441/LTC1442
U PACKAGE DESCRIPTION N8 Package 8-Lead PDIP (Narrow 0.300)
(LTC DWG # 05-08-1510) .400* (10.160) MAX 8 7 6 5 .255 ± .015* (6.477 ± 0.381) 1 2 3 4 .300 – .325 .045 – .065 .130 ± .005 (7.620 – 8.255) (1.143 – 1.651) (3.302 ± 0.127) .065 (1.651) .008 – .015 TYP .120 (0.203 – 0.381) (3.048) .020 +.035 MIN (0.508) .325 –.015 MIN .100 .018 ± .003 +0.889 8.255 (2.54) (0.457 ± 0.076) ( ) –0.381 N8 1002 BSC NOTE: INCHES 1. DIMENSIONS ARE MILLIMETERS *THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)
S8 Package 8-Lead Plastic Small Outline (Narrow 0.150)
(LTC DWG # 05-08-1610) .189 – .197 (4.801 – 5.004) .045 ±.005 NOTE 3 .050 BSC 8 7 6 5 .245 MIN .160 ±.005 .150 – .157 .228 – .244 (3.810 – 3.988) (5.791 – 6.197) NOTE 3 .030 ±.005 TYP 1 2 3 4 RECOMMENDED SOLDER PAD LAYOUT .010 – .020 × 45° .053 – .069 (0.254 – 0.508) (1.346 – 1.752) .004 – .010 .008 – .010 0 (0.101 – 0.254) (0.203 – 0.254) °– 8° TYP .016 – .050 .014 – .019 .050 (0.406 – 1.270) (0.355 – 0.483) (1.270) NOTE: TYP BSC INCHES 1. DIMENSIONS IN (MILLIMETERS) 2. DRAWING NOT TO SCALE 3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm) SO8 0303 144012fd Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen- tation that the interconnection of its circuits as described herein will not infringe on existing patent rights. 15
U PACKAGE DESCRIPTION N8 Package 8-Lead PDIP (Narrow 0.300)
(LTC DWG # 05-08-1510) .400* (10.160) MAX 8 7 6 5 .255 ± .015* (6.477 ± 0.381) 1 2 3 4 .300 – .325 .045 – .065 .130 ± .005 (7.620 – 8.255) (1.143 – 1.651) (3.302 ± 0.127) .065 (1.651) .008 – .015 TYP .120 (0.203 – 0.381) (3.048) .020 +.035 MIN (0.508) .325 –.015 MIN .100 .018 ± .003 +0.889 8.255 (2.54) (0.457 ± 0.076) ( ) –0.381 N8 1002 BSC NOTE: INCHES 1. DIMENSIONS ARE MILLIMETERS *THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)
S8 Package 8-Lead Plastic Small Outline (Narrow 0.150)
(LTC DWG # 05-08-1610) .189 – .197 (4.801 – 5.004) .045 ±.005 NOTE 3 .050 BSC 8 7 6 5 .245 MIN .160 ±.005 .150 – .157 .228 – .244 (3.810 – 3.988) (5.791 – 6.197) NOTE 3 .030 ±.005 TYP 1 2 3 4 RECOMMENDED SOLDER PAD LAYOUT .010 – .020 × 45° .053 – .069 (0.254 – 0.508) (1.346 – 1.752) .004 – .010 .008 – .010 0 (0.101 – 0.254) (0.203 – 0.254) °– 8° TYP .016 – .050 .014 – .019 .050 (0.406 – 1.270) (0.355 – 0.483) (1.270) NOTE: TYP BSC INCHES 1. DIMENSIONS IN (MILLIMETERS) 2. DRAWING NOT TO SCALE 3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm) SO8 0303 144012fd Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen- tation that the interconnection of its circuits as described herein will not infringe on existing patent rights. 15