Datasheet LMC555 (Texas Instruments) - 4

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LMC555
SNAS558M – FEBRUARY 2000 – REVISED JULY 2016
www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings
Over operating free-air temperature range, unless otherwise noted.(1)(2)(3)
MIN MAX UNIT
Supply 15 V Voltage Input –0.3 (V+) + 0.3 V Output 15 V Curent Output 100 mA Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) See AN-1112 (SNVA009) for DSBGA considerations. (3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
6.2 ESD Ratings VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1500 V (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
LMC555IM −40 125 °C Temperature Range LMC555CM/MM/N/TP −40 85 °C PDIP-8 1126 mW Maximum Allowable Power Dissipation SOIC-8 740 mW at 25°C VSSOP-8 555 mW 8-bump DSBGA 568 mW
6.4 Thermal Information LMC555 THERMAL METRIC(1) SOIC VSSOP PDIP 8-BUMP DSBGA UNIT 8 PINS 8 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 169 225 111 220 °C/W (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated Product Folder Links: LMC555 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 ESD Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information 6.5 Electrical Characteristics 7 Parameter Measurement Information 8 Detailed Description 8.1 Overview 8.2 Functional Block Diagram 8.3 Feature Description 8.3.1 Low-Power Dissipation 8.3.2 Various Packages and Compatibility 8.3.3 Operates in Both Astable and Monostable Mode 8.4 Device Functional Modes 8.4.1 Monostable Operation 8.4.2 Astable Operation 9 Application and Implementation 9.1 Application Information 9.2 Typical Application 9.2.1 Design Requirements 9.2.2 Detailed Design Procedure 9.2.3 Application Curve 9.3 Frequency Divider 9.3.1 Design Requirements 9.3.2 Application Curve 9.4 Pulse Width Modulator 9.4.1 Design Requirements 9.4.2 Application Curve 9.5 Pulse Position Modulator 9.5.1 Design Requirements 9.5.2 Application Curve 9.6 50% Duty Cycle Oscillator 9.6.1 Design Requirements 10 Power Supply Recommendations 11 Layout 11.1 Layout Guidelines 11.2 Layout Example 12 Device and Documentation Support 12.1 Receiving Notification of Documentation Updates 12.2 Community Resources 12.3 Trademarks 12.4 Electrostatic Discharge Caution 12.5 Glossary 13 Mechanical, Packaging, and Orderable Information