Datasheet Texas Instruments 5962-9172701QLA — Ficha de datos
Fabricante | Texas Instruments |
Serie | SN54BCT8374A |
Numero de parte | 5962-9172701QLA |
Dispositivos de prueba de escaneo con flip-flops activados por borde tipo D octal 24-CDIP -55 a 125
Hojas de datos
Scan Test Devices With Octal D-Type Edge-Triggered Flip-Flops datasheet
PDF, 435 Kb, Revisión: E, Archivo publicado: jul 1, 1996
Extracto del documento
Precios
Estado
Estado del ciclo de vida | Activo (Recomendado para nuevos diseños) |
Disponibilidad de muestra del fabricante | No |
Embalaje
Pin | 24 |
Package Type | JT |
Industry STD Term | CDIP |
JEDEC Code | R-GDIP-T |
Package QTY | 1 |
Carrier | TUBE |
Width (mm) | 6.92 |
Length (mm) | 32 |
Thickness (mm) | 4.7 |
Pitch (mm) | 2.54 |
Max Height (mm) | 5.08 |
Mechanical Data | Descargar |
Plan ecológico
RoHS | See ti.com |
Notas de aplicación
- Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)PDF, 105 Kb, Revisión: A, Archivo publicado: agosto 1, 1997
The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi - Semiconductor Packing Material Electrostatic Discharge (ESD) ProtectionPDF, 337 Kb, Archivo publicado: jul 8, 2004
Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge - Introduction to LogicPDF, 93 Kb, Archivo publicado: abr 30, 2015
- Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)PDF, 614 Kb, Revisión: C, Archivo publicado: dic 2, 2015
- Live InsertionPDF, 150 Kb, Archivo publicado: oct 1, 1996
Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha - Power-Up Behavior of Clocked Devices (Rev. A)PDF, 34 Kb, Revisión: A, Archivo publicado: feb 6, 2015
- Input and Output Characteristics of Digital Integrated CircuitsPDF, 1.7 Mb, Archivo publicado: oct 1, 1996
This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou - Designing With Logic (Rev. C)PDF, 186 Kb, Revisión: C, Archivo publicado: jun 1, 1997
Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w - Implications of Slow or Floating CMOS Inputs (Rev. D)PDF, 260 Kb, Revisión: D, Archivo publicado: jun 23, 2016
- TI IBIS File Creation Validation and Distribution ProcessesPDF, 380 Kb, Archivo publicado: agosto 29, 2002
The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
Linea modelo
Serie: SN54BCT8374A (4)
- 5962-9172701Q3A 5962-9172701QLA SNJ54BCT8374AFK SNJ54BCT8374AJT
Clasificación del fabricante
- Semiconductors > Space & High Reliability > Logic Products > Flip-Flop/Latch/Registers
Otros nombres:
59629172701QLA, 5962 9172701QLA