Datasheet ICM7555 (NXP) - 2
| Fabricante | NXP |
| Descripción | General purpose CMOS timer |
| Páginas / Página | 22 / 2 — NXP Semiconductors. ICM7555. General purpose CMOS timer. Applications. … |
| Formato / tamaño de archivo | PDF / 125 Kb |
| Idioma del documento | Inglés |
NXP Semiconductors. ICM7555. General purpose CMOS timer. Applications. Ordering information. Table 1. Type number. Temperature range
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ICM7555
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NXP Semiconductors ICM7555 General purpose CMOS timer 3. Applications
n Precision timing n Pulse generation n Sequential timing n Time delay generation n Pulse width modulation n Pulse position modulation n Missing pulse detector
4. Ordering information Table 1. Ordering information Type number Temperature range Package Name Description Version
ICM7555CD Tamb = 0 °C to +70 °C SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 ICM7555ID Tamb = −40 °C to +85 °C ICM7555CN Tamb = 0 °C to +70 °C DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 ICM7555IN Tamb = −40 °C to +85 °C
5. Functional diagram
flip-flop V RESET DD 8 4 R output comparator A drivers 6 THRESHOLD 3 5 OUTPUT CONTROL_VOLTAGE R comparator B DISCHARGE 7 2 TRIGGER N R 1 GND 1 GND 002aae403
Remark:
Unused inputs should be connected to appropriate voltage from Table 3.
Fig 1. Functional diagram
ICM7555_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 3 August 2009 2 of 22
Document Outline 1. General description 2. Features 3. Applications 4. Ordering information 5. Functional diagram 6. Pinning information 6.1 Pinning 6.2 Pin description 7. Functional description 7.1 Function selection 8. Limiting values 9. Characteristics 10. Typical performance curves 11. Application information 11.1 General 11.2 Power supply considerations 11.3 Output drive capability 11.4 Astable operation 11.5 Monostable operation 11.6 Control voltage 11.7 RESET 12. Package outline 13. Soldering of SMD packages 13.1 Introduction to soldering 13.2 Wave and reflow soldering 13.3 Wave soldering 13.4 Reflow soldering 14. Soldering of through-hole mount packages 14.1 Introduction to soldering through-hole mount packages 14.2 Soldering by dipping or by solder wave 14.3 Manual soldering 14.4 Package related soldering information 15. Abbreviations 16. Revision history 17. Legal information 17.1 Data sheet status 17.2 Definitions 17.3 Disclaimers 17.4 Trademarks 18. Contact information 19. Contents
NXP Semiconductors ICM7555 General purpose CMOS timer 3. Applications
n Precision timing n Pulse generation n Sequential timing n Time delay generation n Pulse width modulation n Pulse position modulation n Missing pulse detector
4. Ordering information Table 1. Ordering information Type number Temperature range Package Name Description Version
ICM7555CD Tamb = 0 °C to +70 °C SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 ICM7555ID Tamb = −40 °C to +85 °C ICM7555CN Tamb = 0 °C to +70 °C DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 ICM7555IN Tamb = −40 °C to +85 °C
5. Functional diagram
flip-flop V RESET DD 8 4 R output comparator A drivers 6 THRESHOLD 3 5 OUTPUT CONTROL_VOLTAGE R comparator B DISCHARGE 7 2 TRIGGER N R 1 GND 1 GND 002aae403
Remark:
Unused inputs should be connected to appropriate voltage from Table 3.
Fig 1. Functional diagram
ICM7555_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 3 August 2009 2 of 22
Document Outline 1. General description 2. Features 3. Applications 4. Ordering information 5. Functional diagram 6. Pinning information 6.1 Pinning 6.2 Pin description 7. Functional description 7.1 Function selection 8. Limiting values 9. Characteristics 10. Typical performance curves 11. Application information 11.1 General 11.2 Power supply considerations 11.3 Output drive capability 11.4 Astable operation 11.5 Monostable operation 11.6 Control voltage 11.7 RESET 12. Package outline 13. Soldering of SMD packages 13.1 Introduction to soldering 13.2 Wave and reflow soldering 13.3 Wave soldering 13.4 Reflow soldering 14. Soldering of through-hole mount packages 14.1 Introduction to soldering through-hole mount packages 14.2 Soldering by dipping or by solder wave 14.3 Manual soldering 14.4 Package related soldering information 15. Abbreviations 16. Revision history 17. Legal information 17.1 Data sheet status 17.2 Definitions 17.3 Disclaimers 17.4 Trademarks 18. Contact information 19. Contents