Datasheet HAT2169H (Renesas) - 6

FabricanteRenesas
DescripciónSilicon N Channel Power MOS FET
Páginas / Página10 / 6 — Static Drain to Source on State Resistance. vs. Temperature Forward …
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Static Drain to Source on State Resistance. vs. Temperature Forward Transfer Admittance vs. Drain Current

Static Drain to Source on State Resistance vs Temperature Forward Transfer Admittance vs Drain Current

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Static Drain to Source on State Resistance
vs. Temperature Forward Transfer Admittance vs.
Drain Current
Forward Transfer Admittance |yfs| (S) Static Drain to Source on State Resistance
RDS(on) (mΩ) HAT2169H 10
Pulse Test
8 ID = 10 A, 20 A
50 A 6
VGS = 4.5 V
4 10 A, 20 A, 50 A
2 10 V 0
-25 0 25 50 75 100 125 150 Case Temperature Tc 1000
300
100
Tc = –25°C 30
10 75°C 3 25°C 1 0.1
0.1 3 10 30 100 Typical Capacitance vs.
Drain to Source Voltage
10000
Ciss Capacitance C (pF) Reverse Recovery Time trr (ns) 1 Drain Current ID (A) 100 50 20
di / dt = 100 A / µs
VGS = 0, Ta = 25°C 10
0.1 0.3 1 3 10 Reverse Drain Current 30 3000
1000 Coss 300 Crss 100
30 VGS = 0
f = 1 MHz 10
100 0 IDR (A) 5 12 VDS = 25 V 20 8 VDD
10 V 4 5V 0 40 80 Gate Charge Rev.4.00 Sep 20, 2005 page 4 of 7 120 160 Qg (nc) 20 25 30 0
200 1000 Switching Time t (ns) 30 16 VGS (V) VGS
VDD = 5 V
10 V
25 V 40 10 20 ID = 50 A 15 Switching Characteristics Gate to Source Voltage 50 10 Drain to Source Voltage VDS (V) Dynamic Input Characteristics
VDS (V) 0.3 (°C) Body-Drain Diode Reverse
Recovery Time Drain to Source Voltage VDS = 10 V
Pulse Test 0.3 300
100 td(off) 30
td(on)
tf 10
tr
3 VGS = 10 V, VDS = 10 V
Rg = 4.7 Ω, duty < 1 % 0.1 0.2 0.5 1 2 5 10 20 Drain Current ID (A) 50 100