Datasheet OP220 (Analog Devices) - 4

FabricanteAnalog Devices
DescripciónDual Micropower Operational Amplifier - Obsolete
Páginas / Página12 / 4 — OP220–SPECIFICATIONS. ABSOLUTE MAXIMUM RATINGS*. Package Type. JA*. Unit. …
Formato / tamaño de archivoPDF / 1.2 Mb
Idioma del documentoInglés

OP220–SPECIFICATIONS. ABSOLUTE MAXIMUM RATINGS*. Package Type. JA*. Unit. ORDERING GUIDE. TA = 25. C Package Options. Operating. VOS MAX

OP220–SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS* Package Type JA* Unit ORDERING GUIDE TA = 25 C Package Options Operating VOS MAX

Línea de modelo para esta hoja de datos

Versión de texto del documento

OP220–SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS* Package Type

JA*

JC Unit
Supply Voltage . ± 18 V Differential Input Voltage . 30 V or Supply Voltage 8-Lead Hermetic DIP (Q) 148 16 ∞C/W Input Voltage . Supply Voltage 8-Lead Plastic DIP (N) 103 43 ∞C/W Output Short-Circuit Duration Indefinite Storage Temperature Range . –65∞C to +150∞C 8-Lead SOL (RN) 158 43 ∞C/W Junction Temperature (Ti) . –65∞C to +150∞C TO-99 (H) 150 18 ∞C/W Operating Temperature Range OP220A/OP220C . –55∞C to +125∞C *␪JA is specified for worst-case mounting conditions, i.e., ␪JA is specified for device OP220E/OP220F . –25∞C to +85∞C in socket for CERDIP and PDIP packages; ␪JA is specified for device soldered to printed circuit board for SO packages. OP220G . –40∞C to +85∞C Lead Temperature Range (Soldering, 60 sec) . 300∞C
ORDERING GUIDE
NOTES *Absolute Maximum Ratings apply to packaged parts, unless otherwise noted.
TA = 25

C Package Options Operating VOS MAX Temperature DIE CHARACTERISTICS (mV) CERDIP Plastic TO-99 Range
150 OP220AZ* MIL 150 OP220EZ* IND
1. INVERTING INPUT (A) 2. NONINVERTING INPUT (A)
300 OP220FZ* IND
3. BALANCE (A) 4. V–
750 OP220CJ* MIL
5. BALANCE (B) 6. NONINVERTING INPUT (B)
750 OP220GZ* OP220GP* XIND
7. INVERTING INPUT (B) 8. BALANCE (B)
750 OP220GS XIND
9. V+ 10. OUT (B) 11. V+
For military processed devices, please refer to the Mil Standard
12. OUT (A) 13. V+
Data Sheet
14. BALANCE (A)
OP220AJ/883*.
DIE SIZE 0.097 INCH

0.063 INCH, 6111 SQ. MILS (2.464 mm

1.600 mm, 3.94 SQ. mm)
*Not for new design. Obsolete April 2002.
NOTE : ALL V+ PADS ARE INTERNALL CONNECTED WAFER TEST LIMITS (@ VS =

2.5 V, to

15 V, TA = 25

C, unless otherwise noted.) OP220N Parameter Symbol Conditions Limit Unit
Input Offset Voltage VOS 200 mV Max Input Offset Voltage Match ⌬VOS 300 mV Max Input Offset Current IOS VCM = 0 2 nA Max Input Bias Current IB VCM = 0 25 nA Max Input Voltage Range IVR VS = ±15 V –15/13.5 V Min Common-Mode CMRR V– = 0 V, V+ = 5 V, 0 V £ VCM £ 3.5 V 88 dB Min Rejection Ratio –15 V £ VCM £ 13.5 V, VS = ±15 V 93
OBSOLETE
Power Supply PSRR VS = ±2.5 V to ± 15 V 12.5 mV/V Max Rejection Ratio V– = 0 V, V+ = 5 V to 30 V 22.5 Large-Signal AVO RL = 25 kW, VS = ±15 V 1000 V/mV Min Voltage Gain VO = ± 10 V Output Voltage Swing VO V+ = 5 V, V– = 0 V, RL = 10 kW 0.7/4 V Min VS = ±15 V, RL = 25 kW ±14 Supply Current ISY VS = ±2.5 V, No Load 125 mA Max (Both Amplifiers) VS = ±15 V, No Load 190 NOTE Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packing is not guaranteed for standard product dice. Consult factory to negotiate specifications based on die lot qualification through sample lot assembly and testing. –4– REV. A Document Outline FEATURES GENERAL DESCRIPTION PIN CONFIGURATIONS SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS DIE CHARACTERISTICS ORDERING GUIDE WAFER TEST LIMITS Typical Performance Characteristics INSTRUMENTATION AMPLIFIER APPLICATIONS OF THE OP220 Two Op Amp Configuration THREE OP AMP CONFIGURATION OUTLINE DIMENSIONS Revision History