Datasheet DA9131 (Dialog Semiconductor)

FabricanteDialog Semiconductor
DescripciónHigh-Performance, Dual-Channel DC-DC Converter
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DA9131. High-Performance, Dual-Channel DC-DC Converter. General Description. Key Features. Benefits. Datasheet. Revision 1.0

Datasheet DA9131 Dialog Semiconductor

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DA9131 High-Performance, Dual-Channel DC-DC Converter General Description
DA9131 is a power management unit (PMU) suitable for supplying CPUs, GPUs, DDR memory rails in switches and routers, smart metering, industrial automation, wireless applications, consumer products, SoC/FPGA high performance processing system requiring efficient, high current, power delivery. DA9131 integrates two single-phase buck converters, each phase requiring a small external 0.10 µH inductor. Each buck is capable of delivering up to 5 A output current at a 0.3 V to 1.9 V output voltage range. The 2.5 V to 5.5 V input voltage range is suitable for a wide variety of low-voltage systems. With remote sensing, the DA9131 guarantees the highest accuracy and supports multiple PCB routing scenarios without loss of performance. The pass devices are fully integrated, so no external FETs or Schottky diodes are needed. A programmable soft start-up can be enabled, which limits the inrush current from the input node and secures a slope-controlled rail activation. The dynamic voltage control (DVC) supports adaptive adjustment of the supply voltage dependent on the processor load, via either a direct register write using the communication interface (I2C- compatible) or with a programmable input pin. A configurable GPI allows multiple I2C address selection for multiple instances of DA9131 in the same application. DA9131 has integrated over-temperature and over-current protection for increased system reliability, without the need for external sensing components.
Key Features
■ 2.5 V to 5.5 V input voltage ■ Key safety features ■ 0.3 V to 1.9 V output voltage □ Output under-voltage and over-voltage ■ 4 MHz nominal switching frequency protection ■ □ ±1 % accuracy (static) Input under-voltage protection ■ □ ±5 % accuracy (dynamic) 2-step over-temperature protection ■ ■ I2C-compatible interface (FM+) -40 °C to +85 ºC ambient temperature range ■ Programmable GPIOs ■ 24-pin FCQFN package (nom. 3.3 mm x 4.8 ■ Programmable soft-start mm) ■ Voltage, current, and temperature □ Wettable flanks supervision
Benefits
■ High Efficiency buck converters deliver outstanding thermal performance ■ Fully integrated switching FET’s means no external FETs or Schottky diodes are required ■ Remote sensing guarantees the highest accuracy and supports multiple PCB routing scenarios without loss of performance. ■ Fully programmable soft-start limits the inrush current from the input to give a slope-controlled output voltage. ■ Dynamic voltage control (DVC) enables adaptive adjustment of the device output voltage depending on the load. This increases efficiency when the downstream circuitry enters low power or idle mode, resulting in power savings. ■ Configurable GPIOs support a range of features including I2C, DVC and Power-Good indicator.
Datasheet Revision 1.0 31-Aug-2020
CFR0011-120-00 1 of 53 © 2020 Dialog Semiconductor

Document Outline General Description Key Features Benefits Applications System Diagrams Contents Table of Figures Table of Tables 1 Terms and Definitions 2 Pinout 3 Characteristics 3.1 Absolute Maximum Ratings 3.2 Recommended Operating Conditions 3.3 Thermal Characteristics 3.3.1 Thermal Ratings 3.3.2 Power Dissipation 3.4 ESD Characteristics 3.5 Buck Characteristics 3.6 Performance and Supervision Characteristics 3.7 Digital I/O Characteristics 3.8 Timing Characteristics 3.9 Typical Performance 4 Functional Description 4.1 DC-DC Buck Converter 4.1.1 Switching Frequency 4.1.2 Operation Modes and Phase Selection 4.1.3 Output Voltage Selection 4.1.4 Soft Start-Up and Shutdown 4.1.5 Current Limit 4.1.6 Resistive Divider 4.1.7 Thermal Protection 4.2 Internal Circuits 4.2.1 IC_EN/Chip Enable/Disable 4.2.2 nIRQ/Interrupt 4.2.3 GPIO 4.2.3.1 GPIO Pin Assignment 4.2.3.2 GPIO Function 4.2.3.3 Chip Configuration Select (CONF) 4.3 Operating Modes 4.3.1 ON 4.3.2 OFF 4.4 I2C Communication 4.4.1 I2C Protocol 5 Register Definitions 5.1 Register Map 5.1.1 System 5.1.2 Buck1 5.1.3 Buck2 5.1.4 Serialization 6 Package Information 6.1 Package Outlines 6.2 Moisture Sensitivity Level 6.3 Soldering Information 7 Ordering Information 8 Application Information 8.1 Capacitor Selection 8.2 Inductor Selection