Datasheet DA9131 (Dialog Semiconductor) - 2

FabricanteDialog Semiconductor
DescripciónHigh-Performance, Dual-Channel DC-DC Converter
Páginas / Página53 / 2 — DA9131. High-Performance, Dual-Channel DC-DC Converter. Applications. …
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Idioma del documentoInglés

DA9131. High-Performance, Dual-Channel DC-DC Converter. Applications. Datasheet. Revision 1.0. 31-Aug-2020

DA9131 High-Performance, Dual-Channel DC-DC Converter Applications Datasheet Revision 1.0 31-Aug-2020

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DA9131 High-Performance, Dual-Channel DC-DC Converter
■ Optimized BoM cost and footprint: Each output requires a very small inductor and capacitor delivering parts and cost savings ■ Cycle by cycle current limiting for superior over-current protection
Applications
■ Switches and routers ■ Wireless ■ Smart metering ■ Consumer products ■ Industrial automation ■ SoC/FPGA high performance processing system requiring efficient, high current, power delivery
Datasheet Revision 1.0 31-Aug-2020
CFR0011-120-00 2 of 53 © 2020 Dialog Semiconductor

Document Outline General Description Key Features Benefits Applications System Diagrams Contents Table of Figures Table of Tables 1 Terms and Definitions 2 Pinout 3 Characteristics 3.1 Absolute Maximum Ratings 3.2 Recommended Operating Conditions 3.3 Thermal Characteristics 3.3.1 Thermal Ratings 3.3.2 Power Dissipation 3.4 ESD Characteristics 3.5 Buck Characteristics 3.6 Performance and Supervision Characteristics 3.7 Digital I/O Characteristics 3.8 Timing Characteristics 3.9 Typical Performance 4 Functional Description 4.1 DC-DC Buck Converter 4.1.1 Switching Frequency 4.1.2 Operation Modes and Phase Selection 4.1.3 Output Voltage Selection 4.1.4 Soft Start-Up and Shutdown 4.1.5 Current Limit 4.1.6 Resistive Divider 4.1.7 Thermal Protection 4.2 Internal Circuits 4.2.1 IC_EN/Chip Enable/Disable 4.2.2 nIRQ/Interrupt 4.2.3 GPIO 4.2.3.1 GPIO Pin Assignment 4.2.3.2 GPIO Function 4.2.3.3 Chip Configuration Select (CONF) 4.3 Operating Modes 4.3.1 ON 4.3.2 OFF 4.4 I2C Communication 4.4.1 I2C Protocol 5 Register Definitions 5.1 Register Map 5.1.1 System 5.1.2 Buck1 5.1.3 Buck2 5.1.4 Serialization 6 Package Information 6.1 Package Outlines 6.2 Moisture Sensitivity Level 6.3 Soldering Information 7 Ordering Information 8 Application Information 8.1 Capacitor Selection 8.2 Inductor Selection