Datasheet BPF8089-01SC6 (STMicroelectronics) - 8
| Fabricante | STMicroelectronics |
| Descripción | STA8089 / STA8090 LNA impedance matching with ESD protection in SOT23 |
| Páginas / Página | 14 / 8 — BPF8089-01SC6. Package information. 3.1. SOT23-6L package information. … |
| Formato / tamaño de archivo | PDF / 626 Kb |
| Idioma del documento | Inglés |
BPF8089-01SC6. Package information. 3.1. SOT23-6L package information. Figure 11. SOT23-6L package outline
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BPF8089-01SC6 Package information 3 Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark.
3.1 SOT23-6L package information Figure 11. SOT23-6L package outline
c A1 θ L A H E e D b e A2
Table 3. SOT23-6L package mechanical data Dimensions Ref. Millimeters Inches(1) Min. Typ. Max. Min. Typ. Max.
A 0.9 1.45 0.0354 0.0571 A1 0 0.15 0 0.0059 A2 0.9 1.3 0.0354 0.0512 b 0.30 0.5 0.0118 0.0197 c 0.09 0.2 0.0035 0.0079 D 2.8 3.05 0.1102 0.1201 E 1.5 1.75 0.0591 0.0689 e 0.95 0.0374 H 2.6 3 0.1024 0.1181 L 0.3 0.6 0.0118 0.0236 θ 0 10 0 0.3937 1. Value in inches are converted from mm and rounded to 4 decimal digits
DS13416
-
Rev 1 page 8/14
Document Outline Cover image Application schematic Product status link / summary Features Applications Description 1 Characteristics 1.1 Characteristics (curves) 2 Recommendation on PCB assembly 2.1 Solder paste 3 Package information 3.1 SOT23-6L package information 3.2 Reflow profile 4 Ordering information Revision history
BPF8089-01SC6 Package information 3 Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark.
3.1 SOT23-6L package information Figure 11. SOT23-6L package outline
c A1 θ L A H E e D b e A2
Table 3. SOT23-6L package mechanical data Dimensions Ref. Millimeters Inches(1) Min. Typ. Max. Min. Typ. Max.
A 0.9 1.45 0.0354 0.0571 A1 0 0.15 0 0.0059 A2 0.9 1.3 0.0354 0.0512 b 0.30 0.5 0.0118 0.0197 c 0.09 0.2 0.0035 0.0079 D 2.8 3.05 0.1102 0.1201 E 1.5 1.75 0.0591 0.0689 e 0.95 0.0374 H 2.6 3 0.1024 0.1181 L 0.3 0.6 0.0118 0.0236 θ 0 10 0 0.3937 1. Value in inches are converted from mm and rounded to 4 decimal digits
DS13416
-
Rev 1 page 8/14
Document Outline Cover image Application schematic Product status link / summary Features Applications Description 1 Characteristics 1.1 Characteristics (curves) 2 Recommendation on PCB assembly 2.1 Solder paste 3 Package information 3.1 SOT23-6L package information 3.2 Reflow profile 4 Ordering information Revision history