Datasheet HMC902LP3E (Analog Devices) - 5

FabricanteAnalog Devices
Descripción5 GHz to 11 GHz GaAs, pHEMT, MMIC, Low Noise Amplifier
Páginas / Página13 / 5 — Data Sheet. HMC902LP3E. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. NIC. …
RevisiónE
Formato / tamaño de archivoPDF / 413 Kb
Idioma del documentoInglés

Data Sheet. HMC902LP3E. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. NIC. TOP VIEW. (Not to Scale). RFOUT. GND. PACKAGE. BASE

Data Sheet HMC902LP3E PIN CONFIGURATION AND FUNCTION DESCRIPTIONS NIC TOP VIEW (Not to Scale) RFOUT GND PACKAGE BASE

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Data Sheet HMC902LP3E PIN CONFIGURATION AND FUNCTION DESCRIPTIONS 1 2 C C DD DD NI V V NI 6 5 4 3 1 1 1 1 NIC 1 12 NIC NIC 2 HMC902LP3E 11 NIC TOP VIEW RF 3 (Not to Scale) 10 IN RFOUT GND 4 9 GND 5 6 7 8 C 1 2 C PACKAGE NI GG GG NI BASE V V GND NOTES 1. NIC = NOT INTERNALLY CONNECTED. HOWEVER, ALL DATA SHOWN IN THIS DATA SHEET IS MEASURED WITH THESE PINS CONNECTED TO RF/DC GROUND EXTERNALLY.
2
2. EXPOSED PAD. THE PACKAGE BOTTOM HAS AN EXPOSED
-00
METAL GROUND PADDLE THAT MUST BE CONNECTED TO
524
RF/DC GROUND.
14 Figure 2. Pin Configuration
Table 3. Pin Function Descriptions Pin No. Mnemonic Description
1, 2, 5, 8, 11 to NIC Not Internally Connected. However, all data shown in this data sheet is measured with these pins 13, 16 connected to RF/dc ground externally. 3 RFIN RF Input. This pin is ac-coupled and matched to 50 Ω. See Figure 3 for the interface schematic. 4, 9 GND Ground. Connect these pins to RF/dc ground. See Figure 4 for the interface schematic. 6, 7 VGG1, VGG2 Optional Gate Control for Amplifier. If left open, the amplifier runs self biased at the standard current. Applying a negative voltage reduces drain current. External capacitors are required (see Figure 24). See Figure 5 for the interface schematic. 10 RFOUT RF Output. This pin is ac-coupled and matched to 50 Ω. See Figure 6 for the interface schematic. 14, 15 VDD2, VDD1 Power Supply Voltage for the Amplifier. See Figure 23 and Figure 24 for the application circuits. See Figure 7 for the interface schematic. EPAD Exposed Pad. The package bottom has an exposed metal ground paddle that must be connected to RF/dc ground.
INTERFACE SCHEMATICS RF RF IN OUT
6 03 0 -00 4 4- 52 452 14 1 Figure 3. RFIN Interface Schematic Figure 6. RFOUT Interface Schematic
GND V
04
DD1,
0 4-
VDD2
52 07 14 0 24- 145 Figure 4. GND Interface Schematic Figure 7. VDD1 and VDD2 Interface Schematic -005
VGG1, VGG2
4524 1 Figure 5. VGG1 and VGG2 Interface Schematic Rev. E | Page 5 of 13 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION EVALUATION PRINTED CIRCUIT BOARD (PCB) APPLICATION CIRCUITS OUTLINE DIMENSIONS ORDERING GUIDE