Datasheet PMV65XPEA (Nexperia) - 5

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Nexperia PMV65XPEA 20 V, P-channel Trench MOSFET 9. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance in free air [1] - 230 260 K/W from junction to [2] - 120 140 K/W ambient in free air; t ≤ 5 s [2] - 85 100 K/W Rth(j-sp) thermal resistance - 15 20 K/W from junction to solder point [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for drain 6 cm2. aaa-011994 103 Zth(j-a) (K/W) duty cycle = 1 0.75 102 0.50 0.33 0.25 0.20 0.10 0.05 10 0.02 0.01 0 110-3 10-2 10-1 1 102 103 10 tp (s) FR4 PCB, standard footprint
Fig. 4. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
PMV65XPEA All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved
Product data sheet 27 November 2014 5 / 16
Document Outline 1. General description 2. Features and benefits 3. Applications 4. Quick reference data 5. Pinning information 6. Ordering information 7. Marking 8. Limiting values 9. Thermal characteristics 10. Characteristics 11. Test information 12. Package outline 13. Soldering 14. Revision history 15. Legal information