Datasheet TLC5940 (Texas Instruments) - 6
| Fabricante | Texas Instruments |
| Descripción | 16-channel LED driver w/EEprom dot correction & grayscale PWM control |
| Páginas / Página | 40 / 6 — TLC5940. www.ti.com. Recommended Operating Conditions (continued). MIN. … |
| Formato / tamaño de archivo | PDF / 2.1 Mb |
| Idioma del documento | Inglés |
TLC5940. www.ti.com. Recommended Operating Conditions (continued). MIN. NOM. MAX. UNIT. 6.4 Thermal Information. THERMAL METRIC(1)
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TLC5940
SLVS515D – DECEMBER 2004 – REVISED NOVEMBER 2015
www.ti.com Recommended Operating Conditions (continued) MIN NOM MAX UNIT
tsu0 SIN to SCLK ↑(1) (see Figure 11) 5 ns tsu1 SCLK ↓ to XLAT ↑ (see Figure 11) 10 ns tsu2 VPRG ↑ ↓ to SCLK ↑ (see Figure 11) 10 ns tsu3 Setup time VPRG ↑ ↓XLAT ↑ (see Figure 11) 10 ns tsu4 BLANK ↓ to GSCLK ↑ (see Figure 11) 10 ns tsu5 XLAT ↑ to GSCLK ↑ (see Figure 11) 30 ns tsu6 VPRG ↑ to DCPRG ↑ (see Figure 16) 1 ms th0 SCLK ↑ to SIN (see Figure 11) 3 ns th1 XLAT ↓ to SCLK ↑ (see Figure 11) 10 ns th2 SCLK ↑ to VPRG ↑ ↓ (see Figure 11) 10 ns Hold Time th3 XLAT ↓ to VPRG ↑ ↓ (see Figure 11) 10 ns th4 GSCLK ↑ to BLANK ↑ (see Figure 11) 10 ns th5 DCPRG ↓ to VPRG ↓ (see Figure 11) 1 ms tprog Programming time for EEPROM (see Figure 16) 20 ms (1) ↑ and ↓ indicates a rising edge, and a falling edge respectively.
6.4 Thermal Information TLC5940 THERMAL METRIC(1) PWP (HTSSOP) RHB (VQFN) UNIT 28 PINS 32 PINS
RθJA Junction-to-ambient thermal resistance 36.7 34.3 °C/W RθJC(top) Junction-to-case (top) thermal resistance 18.9 36.8 °C/W RθJB Junction-to-board thermal resistance 15.9 8.5 °C/W ψJT Junction-to-top characterization parameter 0.6 0.3 °C/W ψJB Junction-to-board characterization parameter 15.8 8.7 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 2.3 1.6 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6 Submit Documentation Feedback Copyright © 2004–2015, Texas Instruments Incorporated Product Folder Links: TLC5940 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 ESD Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information 6.5 Electrical Characteristics 6.6 Switching Characteristics 6.7 Typical Characteristics 7 Parameter Measurement Information 7.1 Test Parameter Equations 8 Detailed Description 8.1 Overview 8.2 Functional Block Diagram 8.3 Feature Description 8.3.1 Serial Interface 8.3.2 Error Information Output 8.3.3 TEF: Thermal Error Flag 8.3.4 LOD: LED Open Detection 8.3.5 Delay Between Outputs 8.3.6 Output Enable 8.3.7 Setting Maximum Channel Current 8.4 Device Functional Modes 8.4.1 Operating Modes 8.4.2 Setting DOT Correction 8.4.3 Setting Grayscale 8.4.4 Status Information Output 8.4.5 Grayscale PWM Operation 9 Application and Implementation 9.1 Application Information 9.2 Typical Application 9.2.1 Design Requirements 9.2.2 Detailed Design Procedure 9.2.2.1 Serial Data Transfer Rate 9.2.2.2 Grayscale (GS) Data 9.2.3 Application Curve 10 Power Supply Recommendations 11 Layout 11.1 Layout Guidelines 11.2 Layout Example 11.3 Power Dissipation Calculation 12 Device and Documentation Support 12.1 Community Resources 12.2 Trademarks 12.3 Electrostatic Discharge Caution 12.4 Glossary 13 Mechanical, Packaging, and Orderable Information
TLC5940
SLVS515D – DECEMBER 2004 – REVISED NOVEMBER 2015
www.ti.com Recommended Operating Conditions (continued) MIN NOM MAX UNIT
tsu0 SIN to SCLK ↑(1) (see Figure 11) 5 ns tsu1 SCLK ↓ to XLAT ↑ (see Figure 11) 10 ns tsu2 VPRG ↑ ↓ to SCLK ↑ (see Figure 11) 10 ns tsu3 Setup time VPRG ↑ ↓XLAT ↑ (see Figure 11) 10 ns tsu4 BLANK ↓ to GSCLK ↑ (see Figure 11) 10 ns tsu5 XLAT ↑ to GSCLK ↑ (see Figure 11) 30 ns tsu6 VPRG ↑ to DCPRG ↑ (see Figure 16) 1 ms th0 SCLK ↑ to SIN (see Figure 11) 3 ns th1 XLAT ↓ to SCLK ↑ (see Figure 11) 10 ns th2 SCLK ↑ to VPRG ↑ ↓ (see Figure 11) 10 ns Hold Time th3 XLAT ↓ to VPRG ↑ ↓ (see Figure 11) 10 ns th4 GSCLK ↑ to BLANK ↑ (see Figure 11) 10 ns th5 DCPRG ↓ to VPRG ↓ (see Figure 11) 1 ms tprog Programming time for EEPROM (see Figure 16) 20 ms (1) ↑ and ↓ indicates a rising edge, and a falling edge respectively.
6.4 Thermal Information TLC5940 THERMAL METRIC(1) PWP (HTSSOP) RHB (VQFN) UNIT 28 PINS 32 PINS
RθJA Junction-to-ambient thermal resistance 36.7 34.3 °C/W RθJC(top) Junction-to-case (top) thermal resistance 18.9 36.8 °C/W RθJB Junction-to-board thermal resistance 15.9 8.5 °C/W ψJT Junction-to-top characterization parameter 0.6 0.3 °C/W ψJB Junction-to-board characterization parameter 15.8 8.7 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 2.3 1.6 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6 Submit Documentation Feedback Copyright © 2004–2015, Texas Instruments Incorporated Product Folder Links: TLC5940 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 ESD Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information 6.5 Electrical Characteristics 6.6 Switching Characteristics 6.7 Typical Characteristics 7 Parameter Measurement Information 7.1 Test Parameter Equations 8 Detailed Description 8.1 Overview 8.2 Functional Block Diagram 8.3 Feature Description 8.3.1 Serial Interface 8.3.2 Error Information Output 8.3.3 TEF: Thermal Error Flag 8.3.4 LOD: LED Open Detection 8.3.5 Delay Between Outputs 8.3.6 Output Enable 8.3.7 Setting Maximum Channel Current 8.4 Device Functional Modes 8.4.1 Operating Modes 8.4.2 Setting DOT Correction 8.4.3 Setting Grayscale 8.4.4 Status Information Output 8.4.5 Grayscale PWM Operation 9 Application and Implementation 9.1 Application Information 9.2 Typical Application 9.2.1 Design Requirements 9.2.2 Detailed Design Procedure 9.2.2.1 Serial Data Transfer Rate 9.2.2.2 Grayscale (GS) Data 9.2.3 Application Curve 10 Power Supply Recommendations 11 Layout 11.1 Layout Guidelines 11.2 Layout Example 11.3 Power Dissipation Calculation 12 Device and Documentation Support 12.1 Community Resources 12.2 Trademarks 12.3 Electrostatic Discharge Caution 12.4 Glossary 13 Mechanical, Packaging, and Orderable Information