Datasheet DML1012ALDSQ (Diodes) - 8

DML1012ALDSQ Application Information
(continued)
Thermal Considerations
To ensure proper operation, the maximum junction temperature of the DML1012ALDSQ should not exceed +150°C. Several factors attribute to the junction temperate rise: load current, MOSFET on-resistance, junction-to-ambient thermal resistance, and ambient temperature. The maximum load current can be determined by: Where ILOAD(MAX) is the maximum allowable current on load (A). (6A for DML1012ALDSQ) TJ(MAX) is the maximum allowable junction temperature. TC is the case temperature of the device. θJC = junction to case thermal impedance. This parameter is highly dependent upon PCB layout.
PCB Layout Consideration
1. Place the input/output capacitors CIN and COUT as close as possible to the IN and OUT pins. 2. The power traces, which are IN trace, OUT trace and GND trace, should be short, wide and directly for minimizing parasitic inductance. 3. Place CVBIAS capacitor near the device pin. 4. Connect the signal ground to the GND pin and keep a single connection from GND pin to the power ground behind the input or output capacitors. 5. For better power dissipation, holes are recommended to connect to the exposed pad’s landing area with a large copper polygon on the other side of the printed circuit board. The copper polygons and exposed pad shall connect to IN pin on the printed circuit board. PGND (Power) C C IN OUT VIN VOUT IN 1 8 OUT IN CVBIAS IN 2 7 OUT VBIAS 3 6 OUT EPAD ON 4 5 GND GND (Signal) DML1012ALDSQ 8 of 12 April 2026 Document number: DS46286 Rev. 2 - 2
www.diodes.com
© 2026 Copyright Diodes Incorporated. All Rights Reserved.