Datasheet PMV30UN (Nexperia) - 4
| Fabricante | Nexperia |
| Descripción | N-channel TrenchMOS ultra low level FET in SOT23 package |
| Páginas / Página | 12 / 4 — Philips Semiconductors. PMV30UN. TrenchMOS™ ultra low level FET. Thermal … |
| Formato / tamaño de archivo | PDF / 244 Kb |
| Idioma del documento | Inglés |
Philips Semiconductors. PMV30UN. TrenchMOS™ ultra low level FET. Thermal characteristics. Table 3:. Symbol Parameter. Conditions
Línea de modelo para esta hoja de datos
Versión de texto del documento
link to page 4
Philips Semiconductors PMV30UN
µ
TrenchMOS™ ultra low level FET 4. Thermal characteristics Table 3: Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit
Rth(j-sp) thermal resistance from junction to solder point Figure 4 - - 65 K/W
4.1 Transient thermal impedance
03am32 102 Zth(j-sp) (K/W) δ = 0.5 0.2 10 0.1 0.05 tp P δ = 0.02 T single pulse tp t T 1 10-4 10-3 10-2 10-1 1 10 tp (s)
Fig 4. Transient thermal impedance from junction to solder point as a function of pulse duration.
9397 750 11569 © Koninklijke Philips Electronics N.V. 2003. All rights reserved.
Product data Rev. 01 — 25 June 2003 4 of 12
Document Outline 1. Product profile 1.1 Description 1.2 Features 1.3 Applications 1.4 Quick reference data 2. Pinning information 3. Limiting values 4. Thermal characteristics 4.1 Transient thermal impedance 5. Characteristics 6. Package outline SOT23 7. Revision history 8. Data sheet status 9. Definitions 10. Disclaimers 11. Trademarks
Philips Semiconductors PMV30UN
µ
TrenchMOS™ ultra low level FET 4. Thermal characteristics Table 3: Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit
Rth(j-sp) thermal resistance from junction to solder point Figure 4 - - 65 K/W
4.1 Transient thermal impedance
03am32 102 Zth(j-sp) (K/W) δ = 0.5 0.2 10 0.1 0.05 tp P δ = 0.02 T single pulse tp t T 1 10-4 10-3 10-2 10-1 1 10 tp (s)
Fig 4. Transient thermal impedance from junction to solder point as a function of pulse duration.
9397 750 11569 © Koninklijke Philips Electronics N.V. 2003. All rights reserved.
Product data Rev. 01 — 25 June 2003 4 of 12
Document Outline 1. Product profile 1.1 Description 1.2 Features 1.3 Applications 1.4 Quick reference data 2. Pinning information 3. Limiting values 4. Thermal characteristics 4.1 Transient thermal impedance 5. Characteristics 6. Package outline SOT23 7. Revision history 8. Data sheet status 9. Definitions 10. Disclaimers 11. Trademarks