Package Intersil W3x4.12A — Ficha de datos

FabricanteIntersil
SerieWLCSP
Numero de parteW3x4.12A
Package Intersil W3x4.12A

3x4 Array 12 Bolas con 0.40 Pitch Wafer Level Chip Scale Package (WLCSP) (BSC)

Paramétricos

FamilyWLCSP-BPBC
Pin Count12
Length1.69 mm
Width1.39 mm
Thickness0.01 mm
Height max0.02 mm
Weight0.0040 g
Pitch0.02 mm
Lead Free Peak Temperature260 °C
Package IndexW3X4.12A

Linea modelo

Clasificación del fabricante

  • Plastic Packages