Datasheet JX3S0080120M (JX Semiconductor) - 3

JX3S0080120M Typical Performance-Dynamic Symbol Parameter Test Conditions Min. Typ. Max. Unit
Ciss Input Capacitance 1590 pF VDS=1000V,f=1MHZ , Coss Output Capacitance 63 pF VAC=25mV Crss Reverse Transfer Capacitance 3.9 pF gfs Transconductance VDS=20V , ID=20A 12 S EOSS COSS Stored Energy VDS=1000V,f=1MHZ 35.7 μJ EON Turn-On Energy (Body Diode) VDS=800V,VGS=-5/20V， 984 μJ ID=20A ，L=150uH EOFF Turn-Of Energy (Body Diode) TJ=15 0C 165 μJ Qg Total Gate Charge 72 nC VDS=800V, VGS=-5V/20V, Qgs Gate-source Charge 21 nC ID = 20A Qgd Gate-Drain Charge 22 nC RG (int) Internal Gate Resistance f=1MHz,VAC=25mV 3 Ω td(on) Turn-on Delay Time V 58 DS=800V,VGS=-5V/20V, ns tr Rise Time ID =20A, L=150 μH 20.5 ns td(off) Turn-off Delay Time Rext=2.5Ω 35 ns tf Fal Time 17.8 ns
Typical Performance-Reverse Diode(TJ = 25 unless otherwise specified)
Symbol Parameter Test Conditions Min. Typ. Max. Unit VGS=0V,IF=10A,TJ=25C 4.8 6 V VFSD Forward Voltage VGS=0V,IF=10A,TJ=150C 4.2 6 V Is Continuous Diode Forward Current VGS=0V ，TC=25C 27 A trr Reverse Recovery Time VGS=-5 V, IF=20 A, 36 nS Qrr Reverse Recovery Charge VR=800 V, di/dt=900 297 nC A/μs ，TJ=150C Irrm Peak Reverse Recovery Current 15.5 A
Thermal Characteristics
Symbol Parameter Value. Unit  R JC Thermal Resistance, Junction-to-Case 0.86 C/W  R JA Thermal Resistance, Junction-to-Ambient 40 C/W The values are based on the junction-to case thermal impedance which is measured with the device mounted to a large heat sink assuming maximum junction temperature of Tj(max)=150C 3 Document Outline Fig3.Normalized On-Resistance vs. Temperature Fig5. Transfer Characteristic Fig2. Output characteristics (TJ = 150 °C) Fig4. On-Resistance vs. Temperature Fig6. Body Diode Characteristic at 25 ºC Fig7.Threshold Voltage vs. Temperature Fig11. Capacitances vs. Drain-Source Fig8. Gate Charge Characteristics Fig10. Output Capacitor Stored Energy Fig12. Max Power Dissipation Derating Vs TC Fig13. Switching Energy vs. Drain Current Fig17.Transient Thermal Impedance Fig14. Switching Energy vs. RG(ext) Fig16. Switching Times vs. RG(ext) Fig18. Safe Operating Area